Loctite as BGA underfill for lead free process?

Guy's another question, how about any recommendation what type of adhesive to use as underfill for BGA during lead free process? Currently, we are only using Loctite 3609 & 3515 as adhesive we use 3515 as BGA underfill during normal leaded process since curing is almost same with solder melting point at 183C. How about for lead-free process wherein peak temp reach 217C any adhesive that can be recommended so as to support the auto-alignment of BGA during reflow stage?

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