Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


lead free and tombstoning

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#39753

lead free and tombstoning | 16 February, 2006

Hey folks, I was interested in any information that you might have on tombstone reduction when using a lead free solder and profile. Thanks for any input that you may have! -Russ #x

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#39754

lead free and tombstoning | 16 February, 2006


RDR

#39772

lead free and tombstoning | 17 February, 2006

proper pad geometries, accurate placement, and good reflow profile. Are you having problems right now?

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#39776

lead free and tombstoning | 17 February, 2006

with lead-free solders, one would expect to find less instances of tombstoning. this is because SAC alloys are not eutectic and melt over a range of temp (usually 217-220 deg C) instead of at a single temperature. therefore the forces due to solder surface tension are more gradual and there is lesser chance of force mismatch.

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pressure curing ovens

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