Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


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Matt Smith


OSP | 9 October, 2006

Over the past several months we have experienced intermittent problems with wave solder voids on PCBs coated with OSP. We suspect variation in the OSP application process, or oxidation of the surface due to insufficient or degraded OSP. Is there a method by which the OSP can be measured or validated to ensure consistent solderability? What is the preferred method for specifying OSP quality?

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