Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


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IPC-TM-650 | 22 July, 2009

Can someone clarify whether IPC-TM-650 Test Method 2.6.27 (Thermal Stress, Convection Reflow Assembly Simultation) is required for all bare board fabricators? Or is this test method optional, depending on the type or class of boards being fabricated?



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IPC-TM-650 | 23 July, 2009

Things that define the expected product from a board fabricator are: * Fabricator's standard process capability statement. * Buyer's purchase document. * Purchase agreement.

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