Re: Material Property Change During reflow| 23 August, 2000
During the second reflow, the solder remelts and resolidifies. In general, the reflow temperature is not high enough to erase the microstructure developed during the first reflow. As a result, the net effect of a second reflow typically is grain coarsening due to annealing experienced at cooling stage. In addition, more intermetallics will be formed, as a straight forward result of more heat input.