Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.




residues | 22 August, 2000

With the introduction of new lead-free alloys and higher temperatures to meet their specifications, can we expect different and/or more residues in the reflow soldering process?

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Dr. Ning-Cheng Lee


Re: residues | 22 August, 2000

I do not expect that we will see increased residue volumes, but they may be a bit more difficult to remove (in a cleaning process).

A related issue is probe-testability. We can expect, at least initially, that there will be higher defect rates associated with probing due to false "opens". These false opens will be caused by the increased hardness and toughness of the residues, caused by the higher process temperatures.

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