Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.




PIHR | 20 July, 2000

Is the temperature the only drawback when reflowing components other than connectors? for example caps, transformers.

Is there a problem with the soldering quality if the body of the component covers the solder paste?

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Bob Willis


Re: PIHR | 20 July, 2000

In real terms the temperature compatibility is the real issue.

Yes a component can and in most case will cover the paste. The component standoffs must prevent the body contacting the paste to prevent solderballing.

Bob Just back from dinner, my mum called me away !

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