So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free Paste push out does occur and seems to be mostly related to the reduced hole size whish we need to do.
Solder paste reflows back up a pin and in to the hole with little problem provided the pins are not too long, 1-1.5mm below the board. The plating on the pins can be a minor problem if the surface is slow to wet. When trying out the process with different pastes place a piece of white paper under your assembly jig and see if any paste drops down.
In the case of reflow put a copper foil under each of your trial boards on the mesh conveyor with the board on the rails and look for solder spots after reflow, its simple but works.
For people who have been on my PIHR workshops they may like to comment on the video clips I use to show all these things happen.
Bob
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