Component pad design and volume requirements

hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design and pad design to accomodate this. I would like to know if there is any particular literature which provides with information on this and also data on solder volume that needs to be deposited prior to reflow. thanks

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