Rework of BGA part with shield on top

Is anyone reworking BGA parts with an rf shield on top of the package? Any problems getting it off the board? I am running into an issue in that the shield comes off but the part remains on the board - not because solder has not reached melting but due to BGA solder spheres and rf shield are both soldered using a lead free solder. so when the machine lifts the part, only the shield comes off.

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