The technology you are referring to is also known as return-to-web. This panelization method involves a hard tooled perimeter die and a press equipped with an air cushion. The PCB circuit is punched out and then inserted or "pushed" back into the frame of scrap material. This method works well for thru-hole technology utilizing CEM-1 and CEM-3 materials, but is not very pratical for FR-4 substrates. (Although it has been done using relief slots.) This process is not feasible for SMT assembly due to registration and planar issues. I have used this technology very effectively in situations with irregular shaped PCBs and creating common PCB widths for minimim set-up change-over. PCB costs savings of 1-5% are also likely since one of the cost drivers in PCB fabrication is NC route time.
Geographically, I have only seen this commonly used in mid-west U.S. punch-and-crunch PCB shops. For more information, you can contact sales representative Joe Hennessey of Greenslade Sales @ (847) 593-3450. He represents Bartlett Mfg. located in Cary Illinois.