| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or omega wave generator). We've recently acquired a reflow oven and we are wondering if we can do a process as follows: place and reflow solder component side SMT, place and wave solder through hole, place and reflow solder the solder side SMT. Basically, can we reflow solder SMT parts on a board that already filled with a bunch of through-hole parts? | | | | Any other process ideas in the absence of SMT wave solder capability? | | | | Regards, | | | | Paul | | |
| First off how do you intend on getting paste on the second side with PTH parts already installed. It could only be with a dispencer as far as I know. Second, you add a lot of mass for the reflow process and your temps might be too high for PTH parts! | Two possibilities. Paste the top, flip the board and glue the parts on, stuff your PTH and wave solder with what you have. You might be surprised at the results with a single wave. Passives aren't tough to wave. Even if you have some touch up it probably won't be much. If that won't float your boat have selective solder pallets made and do a double sided reflow then stuff your PTH and the pallets will mask off your SMT and you will only wave your PTH. | | Good luck | | Doug's right, if you're carefull with SM layout, that is, orientation, spacing and the like, SM solders fine with a single wave.
Moon Man presented another option in answer to me on another thread, double sided reflow, then cover the bottom side SM with solder mask, then wave solder TH. Depends on your volumes and equipment for dispensing mask. I'm going to give it a try when I get a chance.
Hope it help, Boca
reply »