BGAs and vapor phase

Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still this could be usefull I believe.

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| Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still this could be usefull I believe. |

Hi, SMTASSY

that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. First, we do not do real series produktion, only prototyping up to sometimes 20 units. When I first tried BGA with the vapourphase and had the results checked at an institute for soldering technology they were excellent and that hasn�t changed. I tried 3 different profiles varying the time for the preheat and time over Liquidus and we couldn�t see any differences in the results. We use a medium with 205�C in a batch-system with infrared preheating and second preheating-stop in the unsaturated vapourzone. We use 8 layer multilayer-boards in Ni/Au and no clean 63/37 paste. All I hope is that our subcontractors do a similar good job with their convection-systems.

Wolfgang

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| | Hi, SMTASSY | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | First, we do not do real series produktion, only prototyping up to sometimes 20 units. | When I first tried BGA with the vapourphase and had the results checked at an institute for soldering technology they were excellent and that hasn�t changed. | I tried 3 different profiles varying the time for the preheat and time over Liquidus and we couldn�t see any differences in the results. We use a medium with 205�C in a batch-system with infrared preheating and second preheating-stop in the unsaturated vapourzone. | We use 8 layer multilayer-boards in Ni/Au and no clean 63/37 paste. | All I hope is that our subcontractors do a similar good job with their convection-systems. | | Wolfgang | | Thanks for the input on your process. | We are looking at a system that has convection preheat and then goes in 217C saturated environment. I was wondering if I could pick your brain for another few seconds. I notice you are using a solution at 205C which bring me to the next question. No problem with your bottom heavier part during the second pass. The equipment that I was familiar with used a tray to carry the boards. But it seems that your are working with a edge conveyor? Any data that you can share for operating cost (chemical consumption per 8hrs)?

Mario

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| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to sometimes 20 units. | | When I first tried BGA with the vapourphase and had the results checked at an institute for soldering technology they were excellent and that hasn�t changed. | | I tried 3 different profiles varying the time for the preheat and time over Liquidus and we couldn�t see any differences in the results. We use a medium with 205�C in a batch-system with infrared preheating and second preheating-stop in the unsaturated vapourzone. | | We use 8 layer multilayer-boards in Ni/Au and no clean 63/37 paste. | | All I hope is that our subcontractors do a similar good job with their convection-systems. | | | | Wolfgang | | | | Thanks for the input on your process. | | | We are looking at a system that has convection preheat and then goes in 217C saturated environment. I was wondering if I could pick your brain for another few seconds. I notice you are using a solution at 205C which bring me to the next question. No problem with your bottom heavier part during the second pass. The equipment that I was familiar with used a tray to carry the boards. But it seems that your are working with a edge conveyor? Any data that you can share for operating cost (chemical consumption per 8hrs)? | | Mario |

hi Mario,

my system is an IBL (German brand), it uses a tray looking like I would say a grill for carrying the boards. For the double sided stuff I place a small metall board with some features to get the desired space for the bottom parts underneath ( that�s no problem in vapourphase ). Lucky as I am, I still have enough influence on our developers to avoid the heavier components on the bottomside. It goes up to SO8 and that�s doing fine. On this point of double sided reflow and what parts are sticking in the second cycle held by just the solder I think there is already something ( a list, parts, pins and force ) available in this forum, can�t remember where or from whom exact.

Hope this will help a little bit further,

Wolfgang

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| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototyping up to sometimes 20 units. | | | When I first tried BGA with the vapourphase and had the results checked at an institute for soldering technology they were excellent and that hasn�t changed. | | | I tried 3 different profiles varying the time for the preheat and time over Liquidus and we couldn�t see any differences in the results. We use a medium with 205�C in a batch-system with infrared preheating and second preheating-stop in the unsaturated vapourzone. | | | We use 8 layer multilayer-boards in Ni/Au and no clean 63/37 paste. | | | All I hope is that our subcontractors do a similar good job with their convection-systems. | | | | | | Wolfgang | | | | | | Thanks for the input on your process. | | | | | We are looking at a system that has convection preheat and then goes in 217C saturated environment. I was wondering if I could pick your brain for another few seconds. I notice you are using a solution at 205C which bring me to the next question. No problem with your bottom heavier part during the second pass. The equipment that I was familiar with used a tray to carry the boards. But it seems that your are working with a edge conveyor? Any data that you can share for operating cost (chemical consumption per 8hrs)? | | | | Mario | | | | hi Mario, | | my system is an IBL (German brand), it uses a tray looking like I would say a grill for carrying the boards. | For the double sided stuff I place a small metall board with some features to get the desired space for the bottom parts underneath ( that�s no problem in vapourphase ). | Lucky as I am, I still have enough influence on our developers to avoid the heavier components on the bottomside. It goes up to SO8 and that�s doing fine. | On this point of double sided reflow and what parts are sticking in the second cycle held by just the solder I think there is already something ( a list, parts, pins and force ) available in this forum, can�t remember where or from whom exact. | | Hope this will help a little bit further, | | Wolfgang | | I forgot the consumption. We use the system just for prototyping with a total amount of aproximately 400-500 boards up to now. We didn�t need to add any fluid yet.

Wolfgang

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