| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembly (either manual or automated), reliability (heat sink doesn't fall off with time/temp), cost, and thermal transfer performance. | | Thanks in advance, Doug | The others can give you names. I'll give you trouble. Only kidding.
We use both types. One must be very careful when using adhesives as too much defeats thermal transfer effectiveness. The stuff is only supposed to "smooth" out the rough areas as scratches, dents, and other surface irregularities so an intimate contact, as well as high thermal transfer, is assured.
Rework can be an issue with thermal adhesives as you cannot pull a BGA with its heat sink attached though I doubt, in your perfect process, you'll ever encounter such difficulties. This is where clip on's have an advantage. However, they must be securely attached to ensure, as your concern states, they don't come off.
Earl Moon
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