| | While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | | I thought I'd ask some experts. Any help guys? | | | Gerry: I imagine there could be some combination of conditions where a 125C for 24hr bake can cause co-planarity defects in surface mount devices. But I'm gonna need a couple of six packs to just start hypothesizing in earnest. I keep flashing-on images of a ball-peen hammer. Two things: | | 1 Call that maroon�s bluff � I mean, GIMMME the proof, show me the study. | 2 Baking components degrades the solderability of components and is not good practice. Consider a desiccant cabinet or some packaging approach for your hydroscopic parts. | | TTYL | | Dave F | | | I'm with these guys. I've had parts baked, but never saw coplanarity problems come out of the oven that weren't there when they went into the oven. Oh, wait, now I rememeber - there was that time when the whole waffle tray took a spill - does handling count?
I'm not a fan of baking, either. Parts come with enough solderability isses - far be it for me to add to them. Dessicant storage (pkg or cabinet) should do it.
And as for this sales guy - I'd let him buy me a big lunch with a couple of beers, then ask him to "show me da study." |