Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

ACF Process

Daniel Woon


ACF Process | 23 December, 2001

Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)?

Will the glass crack when a high pressure applied during flip chip placement?

Thanks and regards,


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ACF Process | 3 January, 2002

(Anisotropic Conductive Film)

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