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Heard about flux encapsulant - a compression-flow flu...
- Apr 01, 2002
No experience, but here's a contact ...
- Apr 02, 2002
Flux encapsulant | 1 April, 2002
Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip assembly. It eliminates the need for a separate underfill operation.
Does anyone has experience in actual production run? What is the possible effect for flip chip with pitch 0.5mm and small bump size (0.17mm) and large bump size (0.3mm)?
Does the type of substrate affect the flux encapsulant process also? For example, organic (BT), ceramic (LTCC), flex (polyimide) substrate?
Thanks and regards,
Flux encapsulant | 2 April, 2002
No experience, but here's a contact http://www.cooksonsemi.com/tech_art/pdfs/Ultimate%20FC-Integrated%20Flux_UF.pdf
They may be able to give you leads, if someone here doesn't.
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