Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

BT material properties

C. M. Gabel


BT material properties | 28 January, 2003

I am working with a BGA package. The laminate layer is being modeled as BT-Cu smear. The thermal conductivity of BT is 0.19 W/mK. Does anyone know what the density and specific heat values are for BT?

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BT material properties | 2 February, 2003

Mitsubishi Gas & Chemical's Bismaleimide-Triazine (BT) resin laminates are the defacto standard material for BGA. Have you checked with them?

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