Mark: The best routing of test vias for BGAs is to keep them far away from the device.
We route test pads for the outer two rows of balls and use vias as test pads for the inner rows of balls. Your bottom-side layout is fine.
Yes, on the top-side you can mask up to the via barrel with LPI. Barrel +0-0.003" is probably a good spec.
Here�s another thing to ponder as you�re grinding through this: your wave will probably reflow your BGA pads by conducting heat through those heat pipes next to each ball. So, you potentially have created a real mess for yourself.
Currently we slap a piece of Kapton tape over the via array before wave soldering. Consider plugging the vias with a conductive polymer. We are playing with some goop from DuPont. It would be nice if your designer could give you a thermal sink, but we know how that usually goes. It does give a good reason to have only essential test pads under the BGA!!!
Yes, you can keep the topside tented if you don't wave-solder.
Good luck
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