Our company is putting a BGA/CSP package assembly line together. We have been studying different assembly houses reliability (short and long term) monitoring programs. I was wondering if some of you who use BGA's/CSP's for your MCM's and Hybrid's could give us a sampling of what types of reliability testing you would like to have done to your packages? Thanks for your input in advance!!!
Bob Hartmann Product Marketing Engineer Chip Supply, Inc.