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Component testing

Michael Ling


Component testing | 21 May, 2003

If I need to test whether our products can withstand the solder reflow process, is there any tests that I can perform other than putting the products through the actual relfow process.

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Component testing | 22 May, 2003

The alternative is by looking at all your components data specs (heat-range), especially pay more attentions to heat-sensitive comps, and fine-pitch comps, odd-form comps, draw a diagram on a separate sheet of paper shown that temperature VS those catagories comps at the same chart, draw 2 limit line making sure those comps don't exceed the thermal shock point, and lower than a cold-solder joint point. Good luck.

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