Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

BGA/CSP Rework

Madan Mohan


BGA/CSP Rework | 27 May, 2000


Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that higher temperatures are needed in rework machine compared to the reflow oven. I have problems such as a charred component-substrate (FR4 material) and sometimes insufficient reflow & board warpage (even with 62-mil boards). Please help me with that.


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Re: BGA/CSP Rework | 30 May, 2000

Madan: You're correct most no-leads require higher temperatures. That makes preheating and temperature monitoring all the more important. Good luck. Dave F

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