Armin: Locating vias within the courtyard of components is bad practice. Concerns are:
* Poor solder paste print quality, caused by the via preventing good stencil gasketing. * Poor component reflow, caused by the via holding the component out of the paste. * Shorting between the component and the via, caused by solder flowing up from the wave through the via. * Shorting between the component and the via, caused by solder flowing up from plating within the via. * Shorting between the component and the via, caused by the component metalization touching the via. * Shorting between the via and traces, caused by solder flowing up from the wave through the via. * Shorting between the via and traces, caused by solder flowing up from plating within the via. * Damaged component, caused by heat from the wave conducting through the via. * Poor solder connections, caused by heat from the wave conducting through the via and reflowing solder on the component.
Ta
Dave F
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