Pan Pacific Microelectronics Symposium 2018




Mon, February 11 - Thu, February 14, 2019


Kauai Marriott Resort & Beach Club, Kauai, Hawaii


The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

2019 Program Finalized

The Pan Pac technical committee has finalized the program for the 2019 Symposium. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Processing Technologies, Advanced Process, Advanced Design, Cleaning, Harsh Environments Requirements, Materials Technology, Trends in Advanced Packaging & Interconnects, X-Ray, Inspection, and more.


Feb 19, 2019


Webinar: BGA Reballing - Theory and Hands On

Feb 19, 2019

Elkridge, Maryland

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Feb 21, 2019

Denver, Colorado

Rocky Mountain Expo & Tech Forum

Mar 18, 2019


Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects

Mar 19, 2019

Plano, Texas

Dallas Expo & Tech Forum

See full schedule »

Feb 19, 2019

Dallas, TX

IPC & WHMA Wire Harness Manufacturing Conference

Association Connecting Electronics Industries (IPC)

Feb 19, 2019


BGA Rebaling Webinar


Mar 21, 2019


Should You Clean PCBs?

ZESTRON Americas

Mar 12, 2019

Munich, Germany

LOPEC 2019 - 11th International Exhibition for the Printed Electronics Industry

Messe München GmbH

Mar 13, 2019

Cleveland, OH

Advanced Design & Manufacturing Cleveland

UBM Canon

See electronics manufacturing industry events calendar »

Pan Pacific Microelectronics Symposium 2018 event has been viewed 184 times

Fast PCB Assembly

Reflow Oven