Pan Pacific Microelectronics Symposium 2018




Mon, February 05 - Thu, February 08, 2018


Hapuna Beach Prince Hotel, Big Island, Hawaii


The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Pan Pac Provides You The Latest Research On

  • 3D/Heterogeneous Integration
  • Emerging Technologies
  • Green Electronics
  • High Performance Low I/O
  • Internet of Things (IoT)
  • Material Advances
  • Nanotechnology
  • Photonics
  • Reliability and Quality
  • Trends, Roadmaps, and more..

2018 Plenary Speakers:

  • From Weapons to Wirebonds: How Global Security Drives Innovation, Supply, and Demand - Martin Goetz, Northrop Grumman Corporation
  • The Latest Material Technologies For System in Package - Osamu Suzuki, Namics Corporation
  • Management of Complexity in Research and Development Work - Verena Hein, X-FAB AG; *Kirsten Weide-Zaage, Ph.D., University of Hannover
  • Selected Highlights From the 2017 iNEMI Roadmap and Key Projects to Address Identified Gaps - Bill Bader, iNEMI

2018 Keynote Speakers:

  • Honda's New Mobility System Development Challenge; Key Functions and Devices for Intelligent Mobility System - Yoshiaki Sakagami, Honda
  • Integrated Intelligent Transportation And Key Enablers - Dwight Howard, Delphi Automotive, LLC
  • Cost Effective Solutions for SiP and Miniaturized Modules - Dongkai Shangguan, Ph.D., Flex


Oct 14, 2018

Rosemont, Illinois

SMTA International 2018 Conference & Exhibition

Oct 23, 2018

San Jose, California

International Wafer-Level Packaging Conference (IWLPC)

Nov 13, 2018

Rosemont, Illinois

SMTA-IPC High Reliability Cleaning and Conformal Coating Conference

See full schedule »

SMT assembly factors

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