Tin Whisker - All You Should Know - SMTA Webtorial


Online Events


Thu, May 17 - Fri, May 18, 2018


Two 90 minute Sessions, May 17 and 18, 2018 1:00pm to 2:30pm Eastern

Presented by: Dr. Jennie S. Hwang, H-Technologies Group

For the recent years, concerns about tin whiskers have been intensifying although tin whisker issue and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The webtorial provides a holistic coverage on relevant aspects of tin whiskers from both physical/phenomenal occurrence and fundamental scientific perspectives. The webtorial also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed. Tin whisker mitigating measures and their relative effectiveness will be highlighted. Your questions and issues for solutions and discussions are welcome.

Main Topics for Part 1:

  • Definition & clarification;
  • Physical phenomena;
  • Reference point;
  • Causes and factors;
  • Concerns & impact;
  • Case Study.

Main Topics for Part 2:

  • Reliability;
  • Test conditions;
  • Mitigation remedies;
  • Relative effectiveness of mitigating measures;
  • Plausible mechanism;
  • Tin whisker vs. tin pest;
  • Summary.

Who Should Attend:

The webtorial provides a working knowledge to all who are involved with or interested in solder joint reliability and system integrity with and without the presence of Bi and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information on the subject.



Oct 23, 2018

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International Wafer-Level Packaging Conference (IWLPC)

Nov 13, 2018

Rosemont, Illinois

SMTA-IPC High Reliability Cleaning and Conformal Coating Conference

See full schedule »

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