Reflow Simulation – X-ray & Optical Help Solves Design & Process
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Mon, April 06, 2020 |
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Reflow defects can be examined and eliminated in manufacture by following some simple steps. Often companies have all the equipment and materials on site to solve process issues very quickly. Bob will illustrate how using optical and x-ray reflow simulation you can examine area array, pin in paste, Package on Package & Underfill failures Presenter: Bob Willis, SMTA Europe With over 30 years’ experience solving assembly and soldering defects Bob Willis will show you how using video simulation you can demonstrate defects happening in real time. The information captured can help prove the root cause of process defects and product failures Topics included in our webinar:
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar |
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