How to Minimize Humidity Interaction with PCBAs for Robustness

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Presenter: Rajan Ambat, Ph.D., Technical University of Denmark

Tuesday, August 18 @ 15:30 (Denmark CEST) | 9:30am (US Eastern)

Overview

Electronic control units, power modules, and consumer electronics are used today worldwide under varying climatic conditions. The climatic conditions with different and varying humidity and temperature can result in transient high humidity and condensing conditions inside the device. Uncontrolled humidity interaction with electronics parts such as PCBA can introduce failures and functionality issues. The formation of water layer on the PCBA surface can be looked as the process of determining the risk of failure occurrence and the failure mode itself i.e. increase of leakage currents, electrochemical migration and corrosion. The parameters such as solder mask, residues from PCBA assembly process, and PCBA layout and components have an influence on the water layer formation on PCBA surface and failures. Therefore it is fundamentally important to understand the influence of these factors and their relation to the sequential failure development under humid conditions and how to avoid them. This webinar will focus on the factors that leads to water film formation on PCBA under humid conditions and show how these factors on the other hand can be used as a means to minimize humidity interaction with PCBA.  Aim is to show the possibility of enhancing intrinsic humidity robustness of PCBA by incremental improvements by controlling the influencing factors. 

About the Presenter:

Dr. Rajan Ambat is currently Professor of Corrosion and Surface Engineering at Division of Materials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark. He is also the Manager for the Centre for Electronic Corrosion/CreCon Industrial Consortium on climatic reliability of electronics at DTU, and Research Manager for the Corrosion node of Danish Hydrocarbon Research and Technology Center. Climatic reliability of electronics is one of the prominent areas of research in his group as part of the Center for Electronic Corrosion in collaboration with many European industries in the power electronics and automotive sector.  Presently he is the Chairman for the Working Party on Corrosion reliability of electronic devices under European Federation of Corrosion and Board member, IMAPS Nordic, Europe. He is part of the editorial board for various corrosion and electrochemistry journals, and held visiting professorship at University of Lille, France and other academic positions/responsibilities in many universities. Presently he is also the Honorary Professor of Amity University, India. He has published more than 250 scientific papers, book contributions, and patents.