Webinar: The IPC Digital Twin Standard


Online Events


Thu, April 08, 2021


Presenters: Radu Diaconsecu, Swie.io, Michael Ford, Aegis Software, Thomas Marktscheffel, ASM Assembly Systems, Hemant ShahIPC-2581 Consortium

Thursday, April 8th, 2021 @ 12:00pm (US Eastern)

Free for SMTA Members! 

Non-Members: $25

Having troubles receiving the discount price? Contact webinars@smta.org


Very little information these days throughout the design, manufacturing and supply-chain, is actually authored outside of the digital domain. Data is everywhere, yet the problem remains as to how it all can be used effectively. Technicians, engineers, and managers are not short of ideas however, as their core know-how and experience are still as appropriate as ever. The real frustration is that most data is not available in a usable format, not shareable between domains, silos and outside of proprietary solutions.

The IPC-2551 Digital Twin standard resolves this situation, setting out the structure, architecture and data content declaration that brings both horizontal and vertical interoperability of new and existing digital twin solutions, expanding their reach and effectiveness, whilst reducing costs and unwanted dependencies.

In this webinar, we start at the top to understand the values and benefits of the digital twin standardization and interoperability, and how it works in the real world, now for everyone.

About the Presenters

Radu Diaconsecu

VP of Business Development, Swie.io

Radu is an Electrical Engineer, with an M.Sc. in Management of Technology from EPFL (Swiss Technical Institute), Lausanne, Switzerland. He Hs a vast industrial experience in the field of electronics and is currently managing Swissmic's business development efforts and sits in the Board of Directors. He also co-chairs the IPC 1782 Critical Components Traceability standard committee and the IPC 2551 Digital Twin Architecture standard committee.

Michael Ford

Director of Emerging Industry Strategy, Aegis Software

Working for Aegis Software provides Michael the opportunity to apply his software for electronics assembly manufacturing experience to further drive technology solution innovation, satisfying evolving business needs in modern digital manufacturing.
Starting his career with Sony, including eight years working in Japan, Michael has been instrumental in creating and evolving revolutionary software solutions for assembly manufacturing, that meet the most demanding expectations.
Today, Michael is an established thought leader for Industry 4.0 and digital Smart factories, an active contributor to industry standards. In 2020, Michael was given an IPC President’s Award as recognition for contributions including the CFX, traceability, secure supply-chain and Digital Twin standards. Michael also regularly contributes articles, columns and blogs in several leading industry publications.

Thomas Marktscheffel

Director of Product Management SW-Integration Platform, ASM Assembly Systems 

Thomas is working for ASM Assembly Systems and in his job as Product Manager he is responsible for defining and building the SW Integration Platform for ASM’s SMT # 1 Smart Factory. As a member of several IPC committees, he is strongly driving for global industry standards such as CFX and Hermes to provide plug and play connectivity for SMT Smart Factories.
Begin of May 1989 Thomas started his career at Siemens AG in Karlsruhe / Germany as a SW developer for power plant control systems. Thomas moved on along different job positions within Siemens AG – Industrial Automation, Motion Control, Siemens Corporate Research „CMM Process Assessments“ – and, begin of 1999, Thomas joined Siemens SIPLACE, which became ASM Assembly Systems begin of 2011. After a 3-year job delegation to Siemens SIPLACE North America in Norcross / GA / USA end of 2003 Thomas became Head of Global SW R&D for Siemens SIPLACE. His time in R&D included a 3-year work assignment to Singapore.

Hemant Shah

Chairman, IPC-2581 Consortium

Hemant Shah is the Chairman of the IPC-2581 Consortium. Shah led the effort to create an industry wide consortium of design and supply chain companies to get IPC-2581 – the standard for transferring PCB design data to manufacturing – adopted. He was at Cadence since 2001 as a product manager for various family of PCB design products until April 2020.
Prior to managing the PCB and FPGA products at Cadence, he managed the Allegro Signal and Power Integrity products for PCB & IC Packaging. Shah also led an industry wide effort to get a new algorithmic modeling standard (IBIS-AMI) approved and adopted.
Prior to joining Cadence Hemant worked at Xynetix Inc. and before that at Intergraph Corporation. He is passionate about developing, marketing leading edge software products for PCB design.



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