Defluxing Advanced Packages

Category

Online Events

Date:

Thu, July 25, 2019

Admission:

free

Description:

To increase power module yield and reliability, many in the electronics industry are developing new power packaging products. There is particular interest in targeting common failure locations, die and substrate attach, interconnection, and encapsulation. The resulting increase in packaging density and introduction of new materials makes it more challenging than ever to meet performance requirements.

Through a series of case studies, this ZESTRON Academy webinar provides a look at factors to consider when selecting cleaning agents and optimizing cleaning processes to ensure material compatibility and maximum reliability.


2019 Cleaning Webinar Series

ZESTRON Academy is pleased to invite production operators, managers and process engineers to participate in our FREE Cleaning Webinar Series. All webinars begin at 1:30 PM EDT, with a 45 minute presentation and 15 minute Q&A.

Url:

pages.zestron.com/defluxing-advanced-packages

Aug 29, 2019

Online

Surface Cleanliness Assessment

Sep 26, 2019

Online

Cleaning Before Conformal Coating

Oct 24, 2019

Online

Multiple Thermal Cycle

See full schedule »

Defluxing Advanced Packages

Fast PCB Assembly