16th International Conference and Exhibition on DEVICE PACKAGING


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Mon, March 02 - Thu, March 05, 2020


WekoPa Resort, Fountain Hills, Arizona


The largest 2020 conference dedicated to 3D Integration, Fan-Out, Wafer Level Packaging & Flip Chip Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Gen Applications (new!)

The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.



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