DesignCon - Where The Chip Meets the Board

Category

Trade Shows

Date:

Tue, January 29 - Thu, January 31, 2019

Location:

Santa Clara Convention Center, Santa Clara, California

Description:

The Definitive Event for the Chip, Board and Systems Design Community

Now in its 22nd year, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities.

Taking place annually in Silicon Valley, DesignCon was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more.

DesignCon enables chip, board, and systems designers, software developers and silicon manufacturers to:

  • Grow their design expertise
  • Learn about and see the latest advanced design technologies and tools from top vendors in the industry
  • Network with and gain inspiration from fellow engineers and design engineering experts

The cutting-edge suppliers you want to meet are at DesignCon. Meet with more than 185 elite vendors to discover and evaluate the latest technologies, gain insight into solving your chip, board, and systems design issues and connect with new and known industry contacts.

The DesignCon Technical Conference Program consists of 14 tracks covering all aspects of electronic design, from chips through boards and systems.

With more than 100 technical paper sessions, panels, and tutorials; conference attendees gather the latest theories, methodologies, applications, and advanced design tools related to signal integrity, power integrity, jitter, crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components, and more.

Url:

http://www.designcon.com

Capillary Underfill Dispensing

convection smt reflow ovens