Moisture Concerns with PWB Materials - CALCE Web Seminar

Category

Online Events

Date:

Tue, July 19, 2011

Description:

The webinar will start with a refresher on printed circuit board fabrication, followed by brief discussion of the moisture transport mechanisms, governing models, and dependent variables. The webinar will then cover the effects of moisture on various susceptible components of a printed circuit board (organic matrix, fillers, interfaces, vias, traces, solder masks etc.) and associated failure modes and mechanisms. Printed circuit board material handling and storage guidelines will be provided. These guidelines are classified based on distinct steps during the printed circuit board manufacturing and assembly process.

Url:

http://www.calce.umd.edu/cgi-bin/entityTools/webmultidbhtmlfrm.cgi?1997/workshops+standard.irp+1

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