End-of-Project Webinar: Board Coplanarity


Online Events


Tue, August 23, 2011


An overview of the results of this project's efforts will be covered in this webinar and is open to all iNEMI members.

With the advent of larger packages and higher densities/pitch, the Industry has been concerned with the coplanarity of both the substrate package and the PCB motherboard. The iNEMI PCB CoPlanarity Working Group generated a snapshot in time of the dynamic coplanarity of several PCB’s designs from four market sectors.

The presentation will present the summarized results of the project’s investigation of the question if room temperature coplanarity measurements can predict the co-planarity at Lead-Free assembly temperatures.

The presentation will also review the project’s results of an investigation into trends in dynamic coplanarity between market sectors, board thickness and global versus local area of concern measurements as well as share the learning and issues of undertaking dynamic co-planarity measurements of PCB motherboards.



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