Leadless Device Rework

The leadless device rework course is comprehensive and employs the skills necessary to perform rework of electronic printed circuit boards that include QFN, LGA, LCC and other leadless device technologies. During the course, the student will be introduced to component identification, terms and definitions, re-bumping techniques, pasting, placing and reflowing, and hands-on soldering/desoldering techniques utilizing state-of-the-art workstations. This course is structured to be in accordance with IPC-A-610, IPC-7711 and IPC-7721.

This class utilizes the following equipment for Leadless Device Rework and Inspection:

   - SRT Summit 1500 Hot Gas Rework Machine
   - OK Industries BGA APR5000 Rework Machine
   - Nicolet NXR 1650-I X-ray Inspection Station
   - Endoscope
   - Leadless Component Identification
   - Rebumping Technique using StencilMate™
   - Desoldering Techniques
   - Site Prep
   - Component Placement
   - Reflowing
   - Hands-on Removal and Replacement

Please click on a link below for the date you would like to attend: