Assembly Challenges of Small Packages - BEST 2015 Tech Symposium

As footprints and pitches of devices continue to shrink,  the challenges you face continue to increase as process engineers. How much paste is on the board? How do I control paste from one print to the next? How do I inspect things that cannot be seen? As you face these challenges, you will want to have a deeper understanding of the forces at work. This symposium will help increase your understanding of the challenges involved in small footprint device assembly. As an extra special treat, Dr. Ronald Lasky, renowned professor and author, will re-solidify your understanding of the design on experiments so you can solve these assembly problems.

Topics and Speakers:

• How to Perform a Designed Experiment - Dr. Ronald Lasky, Indium Corporation
• PCB Assembly Process Development & Characterization of 0.4mm & Smaller Packages - Chrys Shea, Shea Engineering
• SPI Measurements for Small Packages - Joseph Kim, Koh Young
• Jetting for Prototyping & Small Packages - Nico Coenen, Mydata
• Hand Soldering Techniques for Small Packages -Paul Wood, Metcal