SMT Boot Camp Featuing Phil Zarrow
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Date: |
Tue, November 29 - Thu, December 01, 2016 |
Description: |
BEST Boot Camp will teach you the basics of the board assembly process featuring Phil; Zarrow SME from ITM Consulting “Live” PLUS hands-on and local tours Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, he was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes. Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books including "SMT Glossary- Terms and Definitions". Mr. Zarrow holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies. Who Should attend?: This class is for those wanting to get a high level view of SMT assembly and have their questions answered by someone who has a lot of experience and expertise in the field of board assembly. New engineers to this field, applications engineers from device manufacturers as well as designers would do well by spending 3 days in this seminar/tour formatted class. Day 1-2 Introduction
PCB Board Fab
Solder paste
Stencil design
Printing parameters
Component Placement
Overview of the placement process in SMT-tour
Analysis of the reflow process and profiling.
Wave Soldering
Cleaning and cleanliness testing
Testing
Day 3-
Testing and certification |
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