Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial

Category

Online Events

Date:

Wed, April 18 - Thu, April 19, 2018

Description:

The stencil printing process is the most critical process in surface mount electronics assembly. It tremendously influences the quality of the final PCB assembly. This course will provide a thorough understanding of the print process for lead based and lead free solder paste print applications.

Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants in this course are sure to acquire a sound understanding of the solder paste print process and its influence on yield. A brief discussion on the use of this process for adhesive print applications is also included.

Who Should Attend:

  • Process, Design, Test and Quality Engineers
  • Process and Quality Technicians
  • Operators
  • Managers

After completing this course, you will be able to:

  • Understand the stencil printing process and the process parameters, thoroughly.
  • Understand the importance and the influence of solder paste, flux, temperature, humidity, board support and machine setup.
  • Evaluate materials such as paste, stencil and squeegee for efficient printing
  • Understand the various solder paste constituents and types of paste
  • Specify stencils, solder paste and printer requirements for various applications
  • Understand Stencil construction and features for efficient paste transfer
  • Understand squeegees and the recent advances in print technology
  • Evaluate in-coming raw materials and procedure for qualifying vendors
  • Understand the print process for adhesive applications

Url:

https://smta.org/education/presentations/presentations.cfm#stencilprinting

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