Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects


Online Events


Mon, March 18, 2019


The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

Topics include:

  • Design of lands and apertures for fine pitch SMT & BGA
  • Through hole printing requirements
  • Selection of stencils
  • Evaluation of solder pastes
  • Practical machine set-up and trial prints
  • Elimination of board wash-off
  • Assessment of paste and stencil combinations
  • Solder paste inspection, measurement and quality control
  • Stencil Inspection and quality control
  • Cleaning stencils
  • Printed board requirements for printing fine pitch

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.



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