Ball Grid Array Rework - How to Do It Successfully

Surface mount and BGA rework and repair can be straight forward if simple rules are followed. This presentation will give each delegate a step by step blueprint to introduce rework successfully into manufacture. Guidelines will be given on selecting rework equipment, materials and training procedures for defect free soldering. Bob Willis was the creator of the world's first video tapes and interactive CD-ROM on BGA Technology, X-Ray Inspection and BGA Rework which are sold worldwide by IPC and SMTA

Presenter: Bob Willis, SMTA Europe

Topics included:

• Introduction to rework, where and why rework
• Soldering standards & defects, IEC, IPC, BT standards
• Temperature profiling rework sites
• Rework methods for:
• BGA, CSP and other area array package
• Hot gas/IR systems
• Rework of single/double sided boards
• Reballing BGA
• Rework related defects

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like cover in the webinar it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar