Jet Printing and Cleaning Challenges NOV. 15TH


Online Events


Tue, November 15, 2022




Jet Printing and Cleaning Challenges

Nov 15th, 11:00 AM EST

Today’s production environments are overcoming printing challenges by incorporating jet printing as an additional add-on step to add extra solder paste volume when needed. Typically, jet printing pastes use Type 5 and 6 solder powder compared to type 3 and 4. As cleaning remains critical to long-term reliability, jet solder pastes have proven more difficult to clean. Join ZESTRON Academy to explore the reasons behind the increased cleaning challenges with comparative cleaning trial data and customer case studies.

SMT, THT, and semiconductor learning opportunities

ZESTRON Academy is pleased to invite production operators, managers and process engineers to participate in our FREE Cleaning Webinar Series. All webinars begin at 11:00 AM EDT, with a 45 minute presentation and 15 minute Q&A. If there is a specific cleaning topic you are interested in, please visit our customized training page. 


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Stencil, Underside Wipe and Misprint Cleaning Aug 23rd

Sep 20, 2022


Overcoming Challenges for Class III Assemblies SEPT 20th

Oct 18, 2022


Solder Mask and Low Stand-off Component Cleaning OCT 18TH

See full schedule »

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