Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Long Island SMTA Proudly Presents:

When:Wednesday, May 31, 2023
5:00 PM Eastern

Where:Zebra Technologies
One Zebra Plaza
Holtsville, New York  11742
United States

Contact:Thomas Zanatta
Thomas.zanatta@zebra.com
631-738-4208

Online registration is available until: 5/29/2023

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Long Island Chapter In-Person Technical Meeting

“Fine Feature Paste Printing, Stencil Design and Solder Technology”

Wednesday, May 31st, 2023

Zebra Technologies

This event is brought to you free of charge courtesy of the Long Island SMTA Chapter.

 Agenda:

• 5:00 PM Doors Open
• 5:30 PM Dinner meeting starts

Entrance to Zebra Technologies  will require a valid photo identification. Entrance at Security “POST B”

Pre-Registration is required

Speakers:

How to Successfully Implement Component Miniaturization in the Print Process
Michael Butler, MPM-ITWEAE Sales/Applications Engineer
Sales/Applications Engineer

Stencil Technology and Guidelines
Greg Starrett, Stentech
Director of Sales

Assembly Challenges & Solutions for M0201, 08005, and Micro/Mini LED
Timothy O'Neill, Aim Solder
Director of Product Management

Overview:

Increasingly fine pitch component patterns on PCBs continue to narrow the process window for PCB assembly. This is driven by miniaturization where consumers and end users are demanding greater functionality in more compact devices. 

Join us and discover how suppliers of printing machines, stencils, and solder pastes have labored to deal with smaller components and ever-shrinking board topographies and pad sizes.

• Learn about how Printing machine technology continues to advance and meet the fine pitch challenge, new print head technologies and vision systems developed for greater precision.
• Gather information on how stencil manufacturers have developed new technologies, materials and techniques, such as electroformed stencils and nano coatings to improve print quality and increase the printing process window.  
• Gain knowledge of how solder paste manufacturers have designed material to provide stable transfer efficiencies, improved wetting, and low voiding properties and continue developing smaller particle size solder paste and improved flux chemistries for smaller aperture printing 

Health and Safety:

At SMTA, your health and safety are our top priority.  Please make note of our Coronavirus Health and Safety Guide.  Visiting any public space puts you at a higher risk of contracting an illness. By registering and attending an SMTA event, you are doing so at your own risk.