R&D technician

Description:
Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets.  You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avago Technologies.
The R&D Technician will perform the critical functions of programming, set-up, operation and some maintenance of semiconductor packaging equipment for the prototype lab at Avago San Jose. Position will also require knowledge of assembly processes and materials, and ability to author some assembly documentation.

Key qualifications include:

• Minimum five years of hands on experience in maintaining, setting up (programming) and operating automatic assembly equipment, including but not limited to automatic flip chip die bonder, automatic wire bonder, SMT chipshooter system, flip chip underfill dispensing and transfer molding system. 
• Ability to troubleshoot equipment and resolve equipment / process issues in a fast paced environment
• Write preventive maintenance specifications and schedules, manage maintenance records and critical spare parts lists
• Must be fluent on assembly visual inspection criteria, as well as experience in identifying and correcting assembly issues caused by equipment or process setup
• Capable of working independently under minimal supervision
• Good communication skills with production personnel, internal customers and equipment vendors
• Willing to work on continuous improvement relative to safety, quality, productivity, and material yield
• Basic knowledge on IC assembly process and process development preferred
• Working knowledge of equipment GUI and machine interface systems
• References are required