Electronics Assembly Jobs


Date Posted:

July 5, 2009

Job Category:



Rochester, New York, USA

Willing to Relocate?:


Summary of Qualifications:

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging.

I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly).

My research involves SMT and various inspection and repair methods. I have also worked on reliability testing methods. I have hands on experience with a Stencil printer, Component placement machine, reflow oven, BGA rework station, Scanning electron microscope, Solder paste volume deposition measurement.

My research paper has been selected for a conference (Interpack 09).

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