BankeemChheda-Resume

Date Posted:	July 5, 2009
Job Category:	Engineering
Location:	Rochester, New York, USA
Willing to Relocate?:	Yes
Summary of Qualifications:	I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research involves SMT and various inspection and repair methods. I have also worked on reliability testing methods. I have hands on experience with a Stencil printer, Component placement machine, reflow oven, BGA rework station, Scanning electron microscope, Solder paste volume deposition measurement. My research paper has been selected for a conference (Interpack 09).
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