Solder Paste - Qualitek

Solder Pastequalitek2024-04-02T15:34:47-05:00

Delta Solder Paste

solderpaste

Qualitek has developed several types of high-performance Delta Solder Paste designed for use in Sn/Pb (Leaded) and (Lead Free) RoHS compliant circuit board assembly. Qualitek offers No-Clean, RMA (Rosin Mildly Activated), RA (Rosin Activated) and Water-Soluble solder paste types for surface mount assemblies. Delta Solder Paste types are available for printing, dispensing and package-on-package assembly. Delta Solder Paste is available in jars, syringes and Semco cartridges. | Solder Paste Technical Data & SDS |

Standard Packaging: Delta solder paste is packaged in (250-500 gram jars), (500-700 gram 6 oz. and (1000-1400 gram 12 oz. Semco Cartridges) or (35 gram 10cc and 100 gram 30cc syringes)

NO-CLEAN

Type	Process	Features	J-STD-004B	RoHs Compliant
670I	No-Clean	Robust Drop-in ready Sn/Pb paste with low residue and non-conductive residues \| 670I TDS \| 670I SDS \|	REL0	No
XP692	No-Clean	Excellent wettability, extended tack time, yields soft, non-tacky residues \| XP692 TDS \| XP692 SDS \|	REL0	No
699	No-Clean	Halogen-Free paste with excellent wetting and coalescence for fine pitch \| 699 TDS \| 699 SDS \|	ROL0	No
825HF	No-Clean	Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence \| 825HF TDS \| 825HF SDS \| 825HF Flyer \|	ROL0	Yes
863	No-Clean	Low voiding paste with excellent wettability \| 863 TDS \| 863 SDS \|	ROL0	Yes
866	No-Clean	Zero-halogen paste with light-colored, pin probable residues \| 866 TDS \| 866 SDS \|	ROL0	Yes
875	No-Clean	Superior low flux spatter \| 875 TDS \| 875 SDS \|	REL0	Yes
615D	No-Clean	Dispensing solder paste with hard non-conductive residues \| 615D TDS \| 615D SDS \|	REL0	No
618D	No-Clean	Specifically designed for Pb-Free applications, Easily dispensed for rework applications \| 618D TDS \| 618D SDS \|	ROL0	Yes
619D	No-Clean	Dispensing solder paste with transparent, pin testable post soldering residues \| 619D TDS \| 619D SDS \|	REL0	No

WATER-SOLUBLE

Type	Process	Features	J-STD-004B	RoHs Compliant
769LF	Water-Soluble	Newest solder paste formulation, features Zero-Halogens. Enhanced print characteristics on fine pitch pads. Excellent wetting/coalescence and cleanability \| 769LF TDS \| 769LF SDS \| Flyer \|	ORH0	Yes
787LV	Water-Soluble	Lowest voiding solder paste formulated for fine pitch printing with enhanced stencil life \| 787LV TDS \| 787LV SDS \|	ORH0	Yes
788	Water-Soluble	Non-hygroscopic paste where residues are easily removed, long stencil life \| 788 TDS \| 788 SDS \|	ORL0	No
792	Water-Soluble	Robust Sn/Pb paste designed for ultrafine pitch printing, Halide-free, 792 also exhibits excellent performance with Pb-Free alloys Leaded: \| 792 TDS \| 792 SDS \| Lead Free: \| 792 TDS \| 792 SDS \|	ORM0	No/Yes
798	Water-Soluble	Excellent wetting on OSP surfaces, pin testable paste with low residues \| 798 TDS \| 798 SDS \|	ORL0	No
798LF	Water-Soluble	Water-Soluble paste with enhanced activity for a broad range of applications, Exhibits excellent printing characteristics with easy residue removal properties \| 798LF TDS \| 798LF SDS \|	ORH0	Yes
XP799	Water-Soluble	Designed for superior wetting on OSP surfaces with extended stencil life \| XP799 TDS \| XP799 SDS \|	ORL0	No
717D	Water-Soluble	Halide-free dispensing paste with easy removal of residues \| 717D TDS \| 717D SDS \|	ORL0	No
718D	Water-Soluble	Dispensing solder paste designed specifically for Pb-Free applications \| 718D TDS \| 718D SDS \|	ORH0	Yes

ROSIN-BASED

Type	Process	Features	J-STD-004B	RoHs Compliant
230	RMA	RMA solder paste that meets no-clean requirements, Excellent soldering performance for both Sn/Pb and lead-free applications Leaded: \| 230 TDS \| 230 SDS \| Lead Free: \| 230 TDS \| 230 SDS \|	ROL0	No/Yes
215D	RMA	Dispensing RMA solder paste with hard, non-conductive residues Leaded: \| 215D TDS \| 215D SDS \| Lead Free: \| 215D TDS \| 215D SDS \|	ROL0	No/Yes
350	RA	Robust Sn/Pb formulation for Sn/Pb and lead-free applications Leaded: \| 350 TDS \| 350 SDS \| Lead Free: \| 350 TDS \| 350 SDS \|	ROM1	No/Yes

HALOGEN-FREE

Type	Process	Features	J-STD-004B	RoHs Compliant
699	No-Clean	Halogen-Free paste with excellent wetting and coalescence for fine pitch \| 699 TDS \| 699 SDS \|	ROL0	No
825HF	No-Clean	Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence \| 825HF TDS \| 825HF SDS \|	ROL0	Yes
863	No-Clean	Halogen-Free technology, low voiding paste with excellent wettability \| 863 TDS \| 863 SDS \|	ROL0	Yes
866	No-Clean	Zero-halogen paste with light-colored, pin probable residues \| 866 TDS \| 866 SDS \|	ROL0	Yes
875	No-Clean	Halogen-Free formulation with superior low flux spatter \| 875 TDS \| 875 SDS \|	REL0	Yes