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This company listing was last updated in September 2011

IRphotonics

IRphotonics is a leader in the design, manufacture, and marketing of Infrared-based materials and systems.

Manufacturer

Our focus is on the following market applications:

  • Assembly and Automation
  • Infrared Transmission and Optics

We think beyond conventional solutions to offer new and innovative applications based on our unique expertise and in-depth understanding of infrared light.

iCure Where light is heat

The iCure™ thermal spot curing unit and light guide are the key elements of IRphotonics' iCure™ group of adhesive heat curing solutions.

iCure™ is an inline fiber optic system that provides localized heat by Infra red radiation in one portable unit to deliver faster and stronger cures than traditional bonding methods. This translates into improved quality, faster throughput and reduced manufacturing costs.

Using infrared light to generate heat, iCure thermal spot curing system is tailor-made for automated manufacturing processes requiring rapid adhesive curing and heating of bonded assemblies.

iGuide Advances Infrared Materials

The iGuide™ group is composed of advanced infrared fiber optic and material for use in industrial, medical, telecom and defense & aerospace applications

Based on a ground-breaking process allowing the production of infrared glass and optical fiber with exceptional properties in the 300 to 5500 nm optical window, iGuide™ can also transmit light from UV to the Mid infrared allowing for a wide range of multi-spectral applications.

 

IRphotonics Postings

1 technical article »

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

Sep 22, 2011 | Ruben Burga, Dr. Mohammed Saad

The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens)....

Void Free Reflow Soldering

ICT Total SMT line Provider