AIM Solder Products

SMT Products and Services offered by AIM Solder


AIM Solder

AIM is a leading global manufacturer of solder assembly materials for the electronics industry. »»

Headquarters: Montreal, Quebec, Canada

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35 listed by AIM Solder

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LV05 No Clean Flux Cored Solder Wire

LV05 no clean flux cored wire is designed for use in high throughput, high volume electronics assembly processes. LV05 demonstrates consistent, rapid wetting required for robotic and rework/hand soldering operations while leaving safe post-soldering residues. This no clean solder wire is engineer...

LV05 No Clean Flux Cored Solder Wire

Solder Materials

DJAW-10 Stencil Cleaner

Introducing DJAW-10, our efficient under stencil wipe solvent compatible with all AIM solder pastes. Ideal for manual or automated application, DJAW-10 reduces solder paste dry-out, enhances fine aperture release, and cuts wipe cycles by 50% compared to IPA alone. Available in 1-gallon, 5-gallon,...

DJAW-10 Stencil Cleaner

Cleaning Agents

REL22 High Reliability Lead-Free Solder Alloy

AIM’s REL22™ alloy is comprised of tin, bismuth, silver, copper, antimony, nickel and trace amounts of elemental grain structure refiners. The alloy provides significantly improved durability for use in applications where thermal shock, vibration and high g-forces are a concern. ...

REL22 High Reliability Lead-Free Solder Alloy

Solder Materials

REL61 Lead-Free Solder Alloy

AIM’s REL61™ is comprised of tin, bismuth, silver, copper and trace amounts of elemental grain structure refiners. REL61 has proven to reduce tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resistance. REL61 provides the ele...

REL61 Lead-Free Solder Alloy

Solder Materials

RMA202-25 Flux

RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based flux, RMA 202-25 offers a wide process window,...

RMA202-25 Flux

Solder Materials

WS482 Cored Wire

WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste chemistries. WS482 offers improved thermal stability, allowing it to be processed with standard or high temperature alloys. WS482 offers residues that are non-corrosive and t...

WS482 Cored Wire

Solder Materials

WS716 Liquid Flux

WS716 is a halogen- and halide-free, alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. WS716 is the liquid version of the WS-477S1 series solder paste. Though designed for application via foam fluxer, WS716 may also be ...

WS716 Liquid Flux

Solder Materials

WS715M Liquid Flux

WS715M is a neutral alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. Though designed for application via foam fluxer, WS715M may also be applied by automated flux sprayers, dipped, or brushed on with favorable results....

WS715M Liquid Flux

Solder Materials

RX18 No Clean Cored Wire Solder

RX18 no clean flux core wire solder was developed to provide excellent soldering results with all alloys and surface finishes. Engineered for robotic soldering, RX18 promotes thermal transfer, fast wetting and rapid solder penetration into plated through holes or surface mount interconnections. R...

RX18 No Clean Cored Wire Solder

Solder Materials

FX16 No Clean Liquid Flux

FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated. FX16 is ideally formulated for point-to-point selective soldering and palletized wave soldering. FX16 provides fast w...

FX16 No Clean Liquid Flux

Solder Materials

SN100C - Lead-Free Solder Alloy

SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughpu...

SN100C - Lead-Free Solder Alloy

Solder Materials

SAC305 Lead-Free Solder Alloy

SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resultin...

SAC305 Lead-Free Solder Alloy

Solder Materials

Sn63/Pb37 Electropure™ High Purity Solder Alloy

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improvi...

Sn63/Pb37 Electropure™ High Purity Solder Alloy

Solder Materials

M8 No Clean, Halogen-Free Solder Paste

AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no ...

M8 No Clean, Halogen-Free Solder Paste

Solder Materials

NC280 Low-Residue Liquid Rework Flux

NC280 is a low-to-medium solids, no-clean liquid flux formulated to leave minimal post-process residues that are pin testable without cleaning.  NC280 offers an excellent activity level with good performance on bare copper, solder coated and organic coated PWBs, leaving negligible post-proce...

NC280 Low-Residue Liquid Rework Flux

Solder Materials

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC257MD prolongs ejector life...

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

Solder Materials

H10 Halogen-Free No Clean Solder Paste

H10 Halogen-Free No Clean Solder Paste is engineered to provide robust, stable performance for automotive, LED lighting and aerospace assemblies. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characte...

H10 Halogen-Free No Clean Solder Paste

Solder Materials

Common Flux Thinner

Common Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications. Use of Common Flux Thinner is suggested when the flux acid number is too high due to solvent evaporation or residues increase due to evaporation. Hig...

Common Flux Thinner

Solder Materials

Underfill FF35

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underfill FF35 offers superior reliability through hi...

Underfill FF35

Materials

Surface Mount Epoxy 4089

Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure, auger valve, piston and pin...

Surface Mount Epoxy 4089

Dispensing

OAJ Cored Wire

OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wetting, and reducing the chances of thermal degradati...

OAJ Cored Wire

Solder Materials

J8 No Clean Jetting Solder Paste

AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed past...

J8 No Clean Jetting Solder Paste

Solder Materials

W20 Water Soluble Solder Paste

AIM’s W20 water soluble solder paste is a zero halide/halogen flux formula. W20 has been engineered for enhanced wetting performance on all solderable electronic surfaces. W20 exhibits excellent print characteristics and 8+ hours of stencil life. W20 highly soluble residues are easily remov...

W20 Water Soluble Solder Paste

Solder Materials

NC No-Clean Tacky/Rework Solder Paste Flux

NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages.<...

NC No-Clean Tacky/Rework Solder Paste Flux

Solder Materials

NC217 Lead-Free & Tin-Lead Gel Flux

NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source.  NC217 Gel Flux is electrically safe even without a thermal profile. This gel flux dries within one hour of use with or without heat and is tack-free after four hours. <...

NC217 Lead-Free & Tin-Lead Gel Flux

Solder Materials

V9 Low-Voiding Solder Paste

V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue ...

V9 Low-Voiding Solder Paste

Solder Materials

NC275B No Clean Liquid Flux

NC275B Liquid Flux is a water-based VOC-Free flux that has performance and reliability characteristics equal or superior to many alcohol-based fluxes. A medium-solids/residue flux, NC275B can be used with all common lead-free wave soldering alloys including tin-silver-copper, tin-silver, tin-copp...

NC275B No Clean Liquid Flux

Solder Materials

NC273LT Solder Paste For Bismuth Bearing Alloys

AIM's NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount. The revolutionary activator system in AIM's new NC273LT low temperature solder paste improves the wetting performan...

NC273LT Solder Paste For Bismuth Bearing Alloys

Solder Materials

NC259FPA Ultrafine No Clean Solder Paste

AIM is pleased to offer NC259FPA Ultrafine No Clean Solder Paste designed for precise print definition with Type 6 and finer solder powder. Solder pastes with ultra fine alloy powders, such as T6  or finer, are essential for a range of emerging and advanced applications where preci...

NC259FPA Ultrafine No Clean Solder Paste

Solder Materials

Surface Mount Epoxy 4044

Epoxy 4044 is single part epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4044 is formulated to resist shear-thinning and has rapid thermal cure properties. The viscosity and surface tension of Epoxy 4044 prov...

Surface Mount Epoxy 4044

Dispensing

Glow Core No Clean Cored Wire Solder

Glow Core is a no-clean cored wire solder designed to offer excellent wetting characteristics. The novel activator in Glow Core produces fast cycle time and powerful capillary action. Glow Core promotes thermal transfer, offering better solder penetration into plated through holes or surface moun...

Glow Core No Clean Cored Wire Solder

Solder Materials

WS488 Water Soluble Solder Paste

AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. WS488 is compatible with all...

WS488 Water Soluble Solder Paste

Solder Materials

One-Step Underfill 688

One-Step Underfill 688 is a low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves product reliability through high Tg, low CTE, and good fill with no voiding. Even though One-Step U...

One-Step Underfill 688

Materials

CX18 No Clean Cored Wire Solder

CX18 is a no clean flux core wire solder designed to offer excellent soldering results with all alloys and on all surface finishes. Engineered for high operator satisfaction CX18 is a low odor/smoke formula which promotes thermal transfer and fast wetting without the need for additional flux. CX1...

CX18 No Clean Cored Wire Solder

Solder Materials

RMA258-15R Rosin Based Solder Paste

RMA258-15R is a rosin based solder paste that has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. RMA258-15R reduces such defects as voiding and eliminates head-in-pillow. The superior wetting ability of RMA258-15R results in bright, smooth and shi...

RMA258-15R Rosin Based Solder Paste

Solder Materials

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