Zymet, Inc Products

SMT Products and Services offered by Zymet, Inc

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Zymet, Inc
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Zymet, Inc Products

Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. »»

Headquarters: E. Hanover, New Jersey, USA

Manufacturer, Manufacturer Manufacturer

8 listed by Zymet, Inc

Product	Category
UV Curable Glob Top and Dam-and-Fill Encapsulants For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline, at low te...	Materials
Ultra-low Stress Die Attach Adhesives For bonding of stress sensitive devices In microelectronics assembly, adhesives are most often used to bond dissimilar materials with mismatched coefficients of thermal expansion. As a consequence, the bonded parts bend at temperatures above and below the adhesive curing temperatu...	Materials
Optoelectronics Adhesives Zymet's optoelectronics adhesives are designed for applications such as fiber assembly, connector or ferrule assembly, VCSEL assembly, Bragg Grating assembly, and many others. The adhesives offer the following features: One component, syringe dispensable syst...	Materials
Non-Conductive Pastes (NCP) For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applications. To fac...	Materials
Thermally Conductive Adhesives For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a significant compo...	Materials
Electrically Conductive Adhesives For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syringe dispensable past...	Materials
Anisotropically Conductive Adhesives For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and chip...	Materials
Underfill Encapsulants for Flip Chips Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to achieve the fast, void free encap...	Materials

Product

UV Curable Glob Top and Dam-and-Fill Encapsulants

For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline, at low te...

Materials

Ultra-low Stress Die Attach Adhesives

For bonding of stress sensitive devices In microelectronics assembly, adhesives are most often used to bond dissimilar materials with mismatched coefficients of thermal expansion. As a consequence, the bonded parts bend at temperatures above and below the adhesive curing temperatu...

Materials

Optoelectronics Adhesives

Zymet's optoelectronics adhesives are designed for applications such as fiber assembly, connector or ferrule assembly, VCSEL assembly, Bragg Grating assembly, and many others. The adhesives offer the following features: One component, syringe dispensable syst...

Materials

Non-Conductive Pastes (NCP)

For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applications. To fac...

Materials

Thermally Conductive Adhesives

For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a significant compo...

Materials

Electrically Conductive Adhesives

For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syringe dispensable past...

Materials

Anisotropically Conductive Adhesives

For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and chip...

Materials

Underfill Encapsulants for Flip Chips

Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to achieve the fast, void free encap...

Materials