Temperature control for etchers, wet benches, process control...
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IC and module handlers, automation, test...
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Handler/prober interface to test, burn in...
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Tiny spring probes (also RF) for test and production...
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General card design, component packages, equipment, component preparation, solder paste, stencil printing, component placement, reflow profiling, adhesives and all other related topics ...
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Layout methodology, Layout specs, Digital/Analogue, High voltage/ high current, High frequency High Speed/Transitions, Differential, Reflection, X-talk, Video/graphics, Impedance / Capacitance / Induction / Resistivity, Earth loop, EMI, etc....
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BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc....
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Theory of adhesion, polymer families, physical and chemical properties of epoxies, urethane, silicones, conformal coatings, specifications, applications, properties, performance, curing mechanisms, thermal and UV curing, polymeric inspection, etc....
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