Hesse Mechatronics Products

SMT Products and Services offered by Hesse Mechatronics


Hesse Mechatronics

Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly. »»

Headquarters: Fremont, California, USA

Manufacturer of Assembly Equipment

Hesse Mechatronics website
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Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specialized bond heads that can be changed out in min...

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

IC Packaging

Digital Inspection Equipment

Atron DC