YINCAE Advanced Materials, LLC. Products

SMT Products and Services offered by YINCAE Advanced Materials, LLC.


YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials. »»

Headquarters: Albany, New York, USA

Adhesives/Dispensing Manufacturer of Assembly Material

YINCAE Advanced Materials, LLC. website
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26 listed by YINCAE Advanced Materials, LLC.

Product

Category

Solder Materials

SMT 158R Application Process

Filled Fluxing Underfill Product...

Materials

Low Temperature Reflowable Underfill Material: SMT 160L

(Albany, NY) 1/3/2018 – YINCAE Advanced Materials has recently developed a low temperature curable reflowable (no flow) underfill: SMT 160L. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and und...

Materials

DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

(Albany, NY) December 22, 2017 – The DA 150 series materials are YINCAE’s new fast curing die attach adhesives. The DA 150 series offers conductive and insulating options to suit a large variety of applications. These products can be cured quickly at 150°C and off...

Materials

YINCAE’S New Reflowable Underfill Material: SMT 160

(Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT processe...

Materials

High Purity Liquid Encapsulant: SMT 158HA

 YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA    (Albany, NY) 10/20/2017 – YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularly desi...

 High Purity Liquid Encapsulant: SMT 158HA

Materials

SMT 88UL Super-Fast Flow Room Temperature Underfill

SMT 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured SMT 88UL can be easily reworked. SMT 88UL not only can be used as a underfill for chip scal...

SMT 88UL Super-Fast Flow Room Temperature Underfill

Materials

SMT 158UL Room Temperature Underfill

SMT 158UL is a super-fast flow capillary underfill, which can flow into 10μm gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured SMT 158UL can be easily reworked. SMT 158UL not only can be used as a underfill for chip scale package, bal...

SMT 158UL Room Temperature Underfill

Materials

BP 256 Ball Attach Adhesive

BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During the reflow process, this polymer adhesive remov...

BP 256 Ball Attach Adhesive

Materials

SMT 158D High Thermal Conductive Underfill

SMT 158D high thermal conductive underfill is a capillary flow underfill, low temperature cure, fast flowing, easy reworking liquid epoxy which can be used as a underfill for flip chip, chip scale package, ball grid array devices, package on package and land grid array application. It is also sui...

SMT 158D High Thermal Conductive Underfill

Materials

SMT 256EP Solder Joint Encapsulant Paste

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and thermal conductivity, outstanding reliability, ...

SMT 256EP Solder Joint Encapsulant Paste

Materials

SMT 266 Solder Joint Encapsulant

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework).  SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, ...

SMT 266 Solder Joint Encapsulant

Materials

SMT 256B Solder Joint Encapsulant

SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhesive and SMT 256B can encapsulate bumps of a com...

SMT 256B Solder Joint Encapsulant

Materials

WL 66O Optical Lens Adhesive

WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to achieve the high reliability. WL 66O not only provid...

WL 66O Optical Lens Adhesive

Materials

TM 150 Solderable Conductive Adhesive

TM 150 series solderable conductive adhesives is rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, and so on, to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. By comparison wit...

TM 150 Solderable Conductive Adhesive

Materials

LEN 66A Optical Bonding Adhesive

LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch screen bonding and so on. After cure, LEN 66A not on...

LEN 66A Optical Bonding Adhesive

Materials

ACP 120 Anti-Oxidation Solderable Coating

ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder ball can be soldered. ACP 120 can be applied u...

ACP 120 Anti-Oxidation Solderable Coating

Materials

DA 90 Die Attach Adhesive

DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using dispense or printing method. It has demonstrated h...

DA 90 Die Attach Adhesive

Materials

SMT 88U Underfill Series

World's First Super Fast Low Temperature Underfill. SMT88U is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a substrate. Advantages include vo...

SMT 88U Underfill Series

Materials

SMT 158 Capillary Underfill

Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package-on-package) and land grid arrays as well...

SMT 158 Capillary Underfill

Materials

DA 150 Die Attach Adhesive

Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printing methods can be used. It has demonstrated high...

DA 150 Die Attach Adhesive

Materials

SMT 256 Solder Joint Encapsulant

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulation adhesive. Th...

SMT 256  Solder Joint Encapsulant

Materials

TGP 110 Thermal Conductive Adhesives

Our TGP110 thermal conductive adhesives is a series of reactive thermal grease with very thin BLT that eliminates micro-bubbles at the rough interface when applied. In service time, it can be cured to form thermal gel or thermal pad but with the performance of thermal phase change. TGP1...

TGP 110 Thermal Conductive Adhesives

Materials

TM 230 Solderable Conductive Adhesives

TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. In comparison to cond...

TM 230 Solderable Conductive Adhesives

Materials

Benchtop Fluid Dispenser

PCB Assembly Price